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1/ 12 tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 14 ? 001 zct : zero current transformer trip coil test sw &r c od scr r vs c vs vz c os c1 c vr c in r in in vr od gnd vs os nr sc 8 7 6 5 1 2 3 4 latch block reference voltage output block recommended value range 0.01 f c od 0.1 f 0.01 f c in 0.1 f 0.01 f c vr 1f 0.01 f c os 1f 0.1 f c vs 10 f 100 r in 5k 100 r ct 5k 39k r vs 150k 100s tr (note 1) 20ms 100s tf (note 2) 20ms r ct earth leakage current detector e arth l eakage c urrent d etector ic bd95820f - lb bd9582 0n- lb general description this is the product guarantees long time support in industrial market. bd95820f - lb/bd95820n - lb integrates leakage detector and amplifier. esp ecially, it is suitable for high sensitivity and a high - speed operation use, and since the operating temperature range is wide, it can be used for various uses. features long t ime s upport a p roduct for industrial a pplications small t emperature fluctuatio n and high i nput s ensitivity wide o perating t emperature r ange applications earth leakage circuit breaker earth leakage circuit relay industrial equipment key specifications o perating s upply v oltage range 12v to 22 v operating t emperature ra nge -20c to +9 5c supply current 330 a (typ) trip voltage 6.1 mv to 8.9 mv output current(t a =- 20 ) - 200 a (min) packages w(typ) x d(typ) x h(max ) sop8 5.00mm x 6.2 0mm x 1.71mm sip8 19 .3 0mm x 10 .5 0mm x 3. 00 mm typical application circuit (n ote 1) time to change into 90% from 10% in the process when the power supply voltage rises to 1 2 v from 0v. (note 2 ) time to change into 90% from 10% in the process when the po wer supply voltage falls from 1 2 v to 0v. product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. zct:zero - phase current transformer c od datashee t downloaded from: http:///
2/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 sop8 (top view) 1 2 3 4 8 7 6 5 1 2 3 4 5 6 7 8 sip8 (top view) in vr od gnd vs os nr sc 8 7 6 5 1 2 3 4 latch block reference voltage output block pin con f iguration s block diagra ms p in d escription s pin no. symbol function 1 vr reference voltage 2 in input 3 gnd ground 4 od output of i nput comparator 5 sc input of latch circuit 6 nr n oise absorption 7 os output 8 vs power supply absolute maximum ratings (t a =25 ) parameter symbol rating unit supply current (note 3 ) i s 8 ma in -vr current i in - vr 250 ma vr pin current i vr 30 ma in terminal current i in 30 ma sc terminal current i sc 5 ma power supply voltage v s 36 v input terminal voltage v vr/in 17 v od/sc/nr/os terminal voltage v od/sc/nr/os 8 v power dissipation p d 0.68 (sop8) (note 4 ) w 1.12 (sip8) (note 5 ) storage temperature t stg - 55 to 150 c (note 3 ) the power - supply voltage is limited by the internal clamping circuit. (note 4 ) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.5mw per 1 c above 25 c . (note 5 ) p d is a value in the package unit. reduce 9.0mw per 1 c above 25 c . caution: operating the ic over the absolute maximum ratings may damage the ic. th e damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circui t protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
3/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 recommended operating rating s parameter symbol limits unit supply voltage v s 12 to 22 v operating temperature t opr -20 to 95 c electrical characteristic s ( u nless otherwise specified, vs =12v, gnd=0v, t a =25 , full range: - 20 c to +95 c) parameter symbol temperature r ange limits unit co nditions min typ max supply current i s1 - 20 c - - 520 a vin=v vr -v in =30mv 25 c - 330 500 95 c - - 460 trip voltage v t full range 6.1 7.5 8.9 mv v t = vin=v vr -v in od source current i odso 25 c - 27.2 - 20.6 - 14.0 a vin=v vr -v in =30mv, v od =1.2v od sink current i odsi 25 c 16.7 26.0 35.3 a v od =0.8v, vin=v vr -v in =0mv os sourc e current i osso - 20 c - 200 - - a v sc =2.0v, v os =0.8v 25 c - 100 - - 95 c - 75 - - os sink current i ossi full range 200 - - a v sc =0.2v, v os =0.2v sc on voltage v scon 25 c 1.00 1.24 1.48 v input clamp voltage v ic full range 4.2 5.5 6.7 v i ic =20ma differential input clamp voltage v idc full range 0.6 1.0 1.4 v i idc =100ma maximum current voltage v sm 25 c 26 29 32 v is=7ma supply current 2 (note 6 ) i os2 full range - 100 - - a is=900a,v sc =2.0v v os =0.8v latch off supply voltage v soff 25 c 2.7 3.7 4 .7 v operating time (note 7 ) t on 25 c 1.8 2.9 4.0 ms (note 6 ) supply current 2 i s os source current value when the power supply current(is=900a) is given. (note 7 ) operating time is time until output voltage reaches 0.8v after detecting the leakage si gnal. conditions : capacitor( 0.047 f ) is connected between od ( os ) and gnd . downloaded from: http:///
4/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1.is1 100 is a vs 100 vs 2.v t 3.i odso vin vin 100 vin vs iod a vod 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 4.i odsi 5.i osso /i ossi 6.v scon 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 7.v ic 8.v idc 9.v sm 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 10.i os2 0.047 f 11.v soff 12.t on vin vs iod a vod vsc ios a vos vsc vos v vs ic vs iidc v vsm is v v os vs 0.047 f v 0.047 f vic v vidc v 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd vsc ios a vos vs is 100 100 100 100 100 100 100 vod v + + + + + test circuit s downloaded from: http:///
5/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 v t v scon t on 0.8v timing chart application hint 1. input resi stance r in larger bias current flow through the input terminal "in in power - up state. this larger current g e nerates undesirable voltage between the input terminals via input resistance. the input resistance should be less th an 5 k so that this terminal vo ltage is restrained under the trip voltage and the voltage never cause any malfunction. even in normal operation, the offset voltage caused via input resistance and bias current might produce undesirable trip voltage shift. the input resistance should be d esigned with sufficient margin against this shift. input v oltage b etween in and vr vin (in - vr) od/sc terminal v oltage v od /v sc os terminal v oltage v os downloaded from: http:///
6/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 0 100 200 300 400 500 600 700 800 0 5 10 15 20 25 30 power supply vs [v] supply current is[ua] -40 -30 -20 -10 0 10 20 30 40 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature ta [ ] rate of fluctuation [%] -500 -400 -300 -200 -100 0 0 5 10 15 20 25 power supply vs [v] os terminal source current i osso [ua] t ypical performance curve s (reference data) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 25 50 75 100 125 150 ambient temperature ta [ ] power dissipation [w] 95 figure 3 trip voltage fluctuation rate - ambient t emperature fig ure 4 os terminal source current - supply voltage 25 105 - 60 fig ure 1 derating curve figure 2 circuit c urrent - supply v oltage rin=1k rin=300 25 105 - 60 sop8 sip8 downloaded from: http:///
7/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 0 1 2 3 4 5 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature ta [ ] operating time t on [ms] 0 2 4 6 8 10 0 1 2 3 4 5 6 7 8 9 10 power supply vs [v] os terminal voltage v os [v] 0 2 4 6 8 10 0.6 0.8 1.0 1.2 1.4 1.6 1.8 sc terminal input voltage v scon [v] os terminal voltage v os [v] t ypical performance curve s(refer ence data) - continued 0 2 4 6 8 10 0 1 2 3 4 5 6 7 8 9 10 power supply vs [ v] os terminal voltage vos [v] figure 5 operating time - ambient t emperature figure 6 latch off s upply v oltage - ambient t emperature figure 7 sc on v oltage - ambient t emperature figure 8 latch on s upply v oltage - ambient t emperature 25 105 - 60 25 105 - 60 25 105 - 60 downloaded from: http:///
8/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 power dissipation power dissipation(total loss) indicates the power that can be consumed by ic at t a =25 c (normal temperature).ic is heated when it consumed power, and the temperature of ic chip becomes higher than ambient temperatur e. the temperature that can be accepted by ic chip depends on circuit configuration, manufacturing process , and consumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temper ature) and thermal resistance of package (heat dissipation capability). the maximum jun ction temperature is typically equal to the maximum value in the storage temperature range. heat generated by consumed power of ic radiates from the mold resin or l ead frame of the package. the parameter which indicates this heat dissipation capability (hardness of heat release)is called thermal resistance, represented by the symbol ja c /w . the temperature of ic inside the package can be estimated by this thermal resistance. fig ure 9(a) shows the model of thermal resistance of the package. thermal resist ance ja , ambient temperature t a , junction temperature t j max , and power dissipation p d c an be calculated by the equation below . ja = (t j max - t a ) / p d c /w derating curve in figure 9(b) indicates power that can be consumed by ic with reference to ambient t emperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. ther mal reduction curve indicates a reference value measured at a specified condition. figure 10 ( a) show a derating curve for an example of b d95820f -lb, b d95820n - lb . derating curve slope unit bd9582 0f- lb (s op8) 5.5 mw/ bd9582 0n- lb (sip8) 9.0 when using the unit above t a =25 , subtract the value above per degree bd9582 0f- lb : permissible dissipation is a valu e when glass epoxy board 70mm70mm1.6mm (cooper foil area below 3% ) is mounted. bd9582 0n- lb : permissible diss ipation is a value in the package unit. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 25 50 75 100 125 150 ambient temperature ta [ ] power dissipation [w] 95 (a) bd9582 0f- lb ? bd9582 0n- lb bd9582 0f- lb (sop8) bd9582 0n- lb (sip8) figure 10. derating curve 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (max) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (max) ?? p d(max) ja2 < ja1 ? ja2 ja2 ? ja1 ja1 t a [ c ] t j max t j max lsi M fig ure 9. thermal resistance and derating (a) thermal r esistance ja =(t j max -t a )/p c /w ?? ta [ ] ? ? tj [ ] M p [w] ambient t emperature t a [c ] chip surface temperature t j [c ] power dissipation of lsi (b) derating c urve ambient temperature t a [c ] t a [ ] downloaded from: http:///
9/ 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 i/o equivalence circuit vcc line (internal power supply line) vcc vcc pin 1 [vr] pin 5 [sc] pin 2 [in] pin 6 [nr] pin 3 [gnd] pin 7 [os] pin 4 [od] pin 8 [vs] vcc vcc vcc vcc vcc pin 7 vs vcc pin 1 pin 6 vs vcc pin 2 100k 300 100k 300 esd pro tect downloaded from: http:///
10 / 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precau tions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block f rom affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. cons ider the effect of te mperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient con dition. 4. ground wiring pattern when using both small - si gnal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line im pedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may resul t in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristi cs of the ic can be approximately obtaine d. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has mor e than one power supply. therefore, give special consideration to power coupling capacitan ce, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electr omagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin ma y subject the ic to stress. always discharge capacitors completely aft er each process or step. the ics power supply should always be turned off completely before connecting or removing it from t he test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use si milar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incor rect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humi d environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely hi gh impedance and extremely low capacitance. if left unconnected, the electric field from the outsid e can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
11 / 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 sip8 (top view) bd95820 lot number 1pin mark operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjac ent elements in order to keep them isolated. p- n junctions are formed at the intersection of the p layers with the n layers of other elements, creat ing a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic dio de. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the oper ation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, con ditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 11 . example of monolithic ic structure ordering informati on b d 9 5 8 2 0 f - l b e 2 part number package f: sop8 n:sip8 product class lb for industrial applications packaging and forming specification e2: embossed tape and reel (sop8) none:container tube (sip8) m arking diagram s sop8 (top view) 9582 0 lot number pin mark downloaded from: http:///
12 / 12 b d95820f - lb bd95820n - lb tsz02201 - 0rcr0gz00120 -1-2 ? 2014 rohm co., ltd. all rights reserved. 08.jun.2016 rev.004 www.rohm.co m tsz22111 ? 15 ? 001 physical dimension tape and reel information revision history date revision changes 13 . jun . 2014 001 new release 29.sep.2014 002 page.1 typical applic ation circuit r in Q 3k - > r in Q 5k page.10 operational notes 13. input resistance r in 28 .sep.2015 003 page.1 key specifications : trip voltage 4.92mv to 11.06mv -> 6.9mv to 8.9mv typical application circuit : add the recommended external parts value page.2 ab solute maximum ratings: add the sentence of caution page.3 electrical characteristic s : trip voltage 4.92mv to 11.06mv - > 6.9mv to 8.9mv page.5 application hint : add 1. input resistance r in (moved from operational notes 13 ) 08 .jun .2016 00 4 page.1 key specifications : trip voltage 6.9mv to 8.9mv - > 6.1mv to 8.9mv page.3 electrical characteristic s : trip voltage 4.92mv to 11.06mv - > 6.1 mv to 8.9mv page.12 revision history (add to revision history rev.003) page.3 recommended operatin g rating s deleted symbols c vs ,c os and moved to page.1 typical application circuit downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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